Summary
Thin film removal is the process of removing a very thin layer of material from a substrate.This process is used in a variety of different application areas, the most common being in the electronics and semiconductors industries. SPI’s G4 pulsed lasers are ideal for thin film removal as their subtle control of pulse characteristics and high repetition rates allow for sufficient pulse overlap at high processing speeds. This application note looks at thin film removal, scribing of molybdenum films and ITO removal and the advantages of using a pulsed fiber laser for this application.
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